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M27C256B
256 Kbit (32Kb x 8) UV EPROM and OTP EPROM
Feature summary

5V 10% supply voltage in Read operation Access time: 45ns Low power consumption: - Active Current 30mA at 5MHz - Standby Current 100A Programming voltage: 12.75V 0.25V Programming time: 100s/Word Electronic signature - Manufacturer Code: 20h - Device Code: 8Dh ECOPACK(R) packages available PDIP28 (B)
28
28
1
FDIP28W (F)

1
PLCC32 (C)
May 2006
Rev 2
1/24
www.st.com 1
Contents
M27C256B
Contents
1 2 Summary description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 2.10 Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Standby mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Two-line output control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 System considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 PRESTO II programming algorithm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Program inhibit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Program Verify . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Erasure operation (applies for UV EPROM) . . . . . . . . . . . . . . . . . . . . . . . 11
3 4 5 6 7
Maximum rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
2/24
M27C256B
List of tables
List of tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Operating modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Electronic signature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 AC measurement conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read mode DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Programming mode DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Read mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Read mode AC characteristics 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Programming mode AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 FDIP28WB - 28 pin Ceramic Frit-seal DIP, with window (round 0.280"), package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 PDIP28 - 28 pin Plastic DIP, 600 mils width, package mechanical data . . . . . . . . . . . . . . 20 PLCC32 - 32 pin Rectangular Plastic Leaded Chip Carrier, package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3/24
List of figures
M27C256B
List of figures
Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 DIP connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 LCC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Programming flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 AC testing input output waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 AC testing load circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Read mode AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Programming and Verify modes AC waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 FDIP28WB - 28 pin Ceramic Frit-seal DIP, with window, package outline . . . . . . . . . . . . . 19 PDIP28 - 28 pin Plastic DIP, 600 mils width, package outline . . . . . . . . . . . . . . . . . . . . . . 20 PLCC32 - 32 pin Rectangular Plastic Leaded Chip Carrier, package outline. . . . . . . . . . . 21
4/24
M27C256B
Summary description
1
Summary description
The M27C256B is a 256 Kbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable). It is ideally suited for microprocessor systems and is organized as 32,768 by 8 bits. The FDIP28W (window ceramic frit-seal package) has a transparent lid which allows the user to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be written to the device by following the programming procedure. For applications where the content is programmed only one time and erasure is not required, the M27C256B is offered in PDIP28 and PLCC32 packages. In order to meet environmental requirements, ST offers the M27C256B in ECOPACK(R) packages. ECOPACK packages are Lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 1. Logic diagram
VCC VPP
15 A0-A14
8 Q0-Q7
E G
M27C256B
VSS
AI00755B
5/24
Summary description Table 1.
A0-A14 Q0-Q7 E G VPP VCC VSS NC DU
M27C256B Signal names
Address Inputs Data Outputs Chip Enable Output Enable Program Supply Supply Voltage Ground Not Connected Internally Don't Use
Figure 2.
DIP connections
VPP A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 VSS 1 28 2 27 3 26 4 25 5 24 6 23 7 22 M27C256B 8 21 9 20 10 19 11 18 12 17 13 16 14 15
AI00756
VCC A14 A13 A8 A9 A11 G A10 E Q7 Q6 Q5 Q4 Q3
6/24
M27C256B Figure 3. LCC connections
A7 A12 VPP DU VCC A14 A13
Summary description
1 32 A6 A5 A4 A3 A2 A1 A0 NC Q0 A8 A9 A11 NC G A10 E Q7 Q6
9
M27C256B
25
17 Q1 Q2 VSS DU Q3 Q4 Q5
AI00757
7/24
Device operation
M27C256B
2
Device operation
The operating modes of the M27C256B are listed in the Operating Modes. A single power supply is required in the read mode. All inputs are TTL levels except for VPP and 12V on A9 for Electronic Signature.
2.1
Read mode
The M27C256B has two control functions, both of which must be logically active in order to obtain data at the outputs. Chip Enable (E) is the power control and should be used for device selection. Output Enable (G) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming that the addresses are stable, the address access time (tAVQV) is equal to the delay from E to output (tELQV). Data is available at the output after delay of tGLQV from the falling edge of G, assuming that E has been low and the addresses have been stable for at least tAVQV-tGLQV.
2.2
Standby mode
The M27C256B has a standby mode which reduces the supply current from 30mA to 100A. The M27C256B is placed in the standby mode by applying a CMOS high signal to the E input. When in the standby mode, the outputs are in a high impedance state, independent of the G input.
2.3
Two-line output control
Because EPROMs are usually used in larger memory arrays, this product features a 2 line control function which accommodates the use of multiple memory connection. The two line control function allows:

the lowest possible memory power dissipation, complete assurance that output bus contention will not occur.
For the most efficient use of these two control lines, E should be decoded and used as the primary device selecting function, while G should be made a common connection to all devices in the array and connected to the READ line from the system control bus. This ensures that all deselected memory devices are in their low power standby mode and that the output pins are only active when data is desired from a particular memory device.
8/24
M27C256B
Device operation
2.4
System considerations
The power switching characteristics of Advance CMOS EPROMs require careful decoupling of the devices. The supply current, ICC, has three segments that are of interest to the system designer: the standby current level, the active current level, and transient current peaks that are produced by the falling and rising edges of E. The magnitude of this transient current peaks is dependent on the capacitive and inductive loading of the device at the output. The associated transient voltage peaks can be suppressed by complying with the two line output control and by properly selected decoupling capacitors. It is recommended that a 0.1F ceramic capacitor be used on every device between VCC and VSS. This should be a high frequency capacitor of low inherent inductance and should be placed as close to the device as possible. In addition, a 4.7F bulk electrolytic capacitor should be used between VCC and VSS for every eight devices. The bulk capacitor should be located near the power supply connection point. The purpose of the bulk capacitor is to overcome the voltage drop caused by the inductive effects of PCB traces.
2.5
Programming
When delivered (and after each erasure for UV EPROM), all bits of the M27C256B are in the "1" state. Data is introduced by selectively programming "0"s into the desired bit locations. Although only "0"s will be programmed, both "1"s and "0"s can be present in the data word. The only way to change a '0' to a '1' is by die exposure to ultraviolet light (UV EPROM). The M27C256B is in the programming mode when VPP input is at 12.75V, G is at VIH and E is pulsed to VIL. The data to be programmed is applied to 8 bits in parallel to the data output pins. The levels required for the address and data inputs are TTL. VCC is specified to be 6.25V 0.25 V.
2.6
PRESTO II programming algorithm
PRESTO II Programming Algorithm allows to program the whole array with a guaranteed margin, in a typical time of 3.5 seconds. Programming with PRESTO II involves the application of a sequence of 100s program pulses to each byte until a correct verify occurs (see Figure 4.). During programming and verify operation, a MARGIN MODE circuit is automatically activated in order to guarantee that each cell is programmed with enough margin. No overprogram pulse is applied since the verify in MARGIN MODE provides necessary margin to each programmed cell.
9/24
Device operation Figure 4. Programming flowchart
VCC = 6.25V, VPP = 12.75V
M27C256B
n=0
E = 100s Pulse NO ++n = 25 YES NO VERIFY YES Last Addr NO ++ Addr
FAIL
YES CHECK ALL BYTES 1st: VCC = 6V 2nd: VCC = 4.2V
AI00760B
2.7
Program inhibit
Programming of multiple M27C256Bs in parallel with different data is also easily accomplished. Except for E, all like inputs including G of the parallel M27C256B may be common. A TTL low level pulse applied to a M27C256B's E input, with VPP at 12.75V, will program that M27C256B. A high level E input inhibits the other M27C256Bs from being programmed.
2.8
Program Verify
A verify (read) should be performed on the programmed bits to determine that they were correctly programmed. The verify is accomplished with G at VIL, E at VIH, VPP at 12.75V and VCC at 6.25V.
2.9
Electronic signature
The Electronic Signature (ES) mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and type. This mode is intended for use by programming equipment to automatically match the device to be programmed with its corresponding programming algorithm. The ES mode is functional in the 25C 5C ambient temperature range that is required when programming the M27C256B. To activate the ES mode, the programming equipment must force 11.5V to 12.5V on address line A9 of the M27C256B, with VCC = VPP = 5V. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during Electronic Signature mode. Byte 0 (A0 = VIL) represents the manufacturer code and byte 1 (A0 = VIH) the device identifier code. For the STMicroelectronics M27C256B, these two identifier bytes are given in Table 3 and can be read-out on outputs Q7 to Q0.
10/24
M27C256B
Device operation
2.10
Erasure operation (applies for UV EPROM)
The erasure characteristics of the M27C256B is such that erasure begins when the cells are exposed to light with wavelengths shorter than approximately 4000 A. It should be noted that sunlight and some type of fluorescent lamps have wavelengths in the 3000-4000 A range. Research shows that constant exposure to room level fluorescent lighting could erase a typical M27C256B in about 3 years, while it would take approximately 1 week to cause erasure when exposed to direct sunlight. If the M27C256B is to be exposed to these types of lighting conditions for extended periods of time, it is suggested that opaque labels be put over the M27C256B window to prevent unintentional erasure. The recommended erasure procedure for the M27C256B is exposure to short wave ultraviolet light which has wavelength 2537A. The integrated dose (i.e. UV intensity x exposure time) for erasure should be a minimum of 15 W-sec/cm2. The erasure time with this dosage is approximately 15 to 20 minutes using an ultraviolet lamp with 12000 W/cm2 power rating. The M27C256B should be placed within 2.5 cm (1 inch) of the lamp tubes during the erasure. Some lamps have a filter on their tubes which should be removed before erasure. Table 2. Operating modes(1)
Mode Read Output Disable Program Verify Program Inhibit Standby Electronic Signature
1. X = VIH or VIL, VID = 12V 0.5V.
E VIL VIL VIL Pulse VIH VIH VIH VIL
G VIL VIH VIH VIL VIH X VIL
A9 X X X X X X VID
VPP VCC VCC VPP VPP VPP VCC VCC
Q7-Q0 Data Out Hi-Z Data In Data Out Hi-Z Hi-Z Codes
Table 3.
Electronic signature
A0 VIL VIH Q7 0 1 Q6 0 0 Q5 1 0 Q4 0 0 Q3 0 1 Q2 0 1 Q1 0 0 Q0 0 1 Hex Data 20h 8Dh
Identifier Manufacturer's Code Device Code
11/24
Maximum rating
M27C256B
3
Maximum rating
Stressing the device above the rating listed in the Absolute Maximum Ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 4.
Symbol TA TBIAS TSTG VIO(2) VCC VA9(2) VPP Ambient Operating
Absolute maximum ratings
Parameter Temperature(1) Value -40 to 125 -50 to 125 -65 to 150 -2 to 7 -2 to 7 -2 to 13.5 -2 to 14 Unit C C C V V V V
Temperature Under Bias Storage Temperature Input or Output Voltage (except A9) Supply Voltage A9 Voltage Program Supply Voltage
1. Depends on range. 2. Minimum DC voltage on Input or Output is -0.5V with possible undershoot to -2.0V for a period less than 20ns. Maximum DC voltage on Output is VCC +0.5V with possible overshoot to VCC +2V for a period less than 20ns.
12/24
M27C256B
DC and AC parameters
4
DC and AC parameters
This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measurement Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 5. AC measurement conditions
High Speed Input Rise and Fall Times Input Pulse Voltages Input and Output Timing Ref. Voltages 10ns 0 to 3V 1.5V Standard 20ns 0.4V to 2.4V 0.8V and 2V
Figure 5.
AC testing input output waveform
High Speed 3V 1.5V 0V
Standard 2.4V 2.0V 0.8V
AI01822
0.4V
13/24
DC and AC parameters Figure 6. AC testing load circuit
1.3V
M27C256B
1N914
3.3k DEVICE UNDER TEST CL
OUT
CL = 30pF for High Speed CL = 100pF for Standard CL includes JIG capacitance
AI01823B
Table 6.
Symbol CIN COUT
2.
Capacitance(1) (2)
Parameter Input Capacitance Output Capacitance Test Condition VIN = 0V VOUT = 0V Min Max 6 12 Unit pF pF
1. Sampled only, not 100% tested. (TA = 25 C, f = 1 MHz)
Table 7.
Symbol ILI ILO ICC ICC1 ICC2 IPP VIL VIH(3) VOL VOH
Read mode DC characteristics(1) (2)
Parameter Input Leakage Current Output Leakage Current Supply Current Supply Current (Standby) TTL Supply Current (Standby) CMOS Program Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage TTL Output High Voltage CMOS IOL = 2.1mA IOH = -1mA IOH = -100A 3.6 VCC - 0.7V Test Condition 0V VIN VCC 0V VOUT VCC E = VIL, G = VIL, IOUT = 0mA, f = 5MHz E = VIH E > VCC - 0.2V VPP = VCC -0.3 2 Min Max 10 10 30 1 100 100 0.8 VCC + 1 0.4 Unit A A mA mA A A V V V V V
1. TA = 0 to 70C, -40 to 85C, -40 to 105C or -40 to 125C; VCC = 5V 5% or 5V 10%; VPP = VCC. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Maximum DC voltage on Output is VCC +0.5V.
14/24
M27C256B Table 8.
Symbol ILI ICC IPP VIL VIH VOL VOH VID
DC and AC parameters Programming mode DC characteristics(1) (2)
Parameter Input Leakage Current Supply Current Program Current Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage TTL A9 Voltage IOL = 2.1mA IOH = -1mA 3.6 11.5 12.5 E = VIL -0.3 2 Test Condition VIL VIN VIH Min Max 10 50 50 0.8 VCC + 0.5 0.4 Unit A mA mA V V V V V
1. TA = 25 C; VCC = 6.25V 0.25V; VPP = 12.75V 0.25V. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
15/24
DC and AC parameters Figure 7.
A0-A14
M27C256B Read mode AC waveforms
VALID tAVQV tAXQX VALID
E tGLQV G tELQV Q0-Q7 tGHQZ Hi-Z tEHQZ
AI00758B
Table 9.
)
Read mode AC characteristics(1) (2)
M27C256B Test Condition
Symbol
Alt
Parameter
-45(3)
-60
-70
-80
Unit
Min Max Min Max Min Max Min Max tAVQV tELQV tGLQV tEHQZ(4) tGHQZ(4) tACC tCE tOE tDF tDF Address Valid to Output Valid Chip Enable Low to Output Valid Output Enable Low to Output Valid Chip Enable High to Output Hi-Z Output Enable High to Output Hi-Z E = VIL, G = VIL G = VIL E = VIL G = VIL E = VIL E = VIL, G = VIL 0 0 45 45 25 25 25 0 0 60 60 30 30 30 0 0 70 70 35 30 30 0 0 80 80 40 30 30 ns ns ns ns ns
tAXQX
Address Transition tOH to Output Transition
0
0
0
0
ns
1. TA = 0 to 70C, -40 to 85C, -40 to 105C or -40 to 125C; VCC = 5V 5% or 5V 10%; VPP = VCC 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Speed obtained with High Speed AC measurement conditions. 4. Sampled only, not 100% tested.
16/24
M27C256B Table 10.
)
DC and AC parameters Read mode AC characteristics 2(1) (2)
M27C256B Symbol Alt Parameter Test Condition -90 -10 -12 -15/-20/-25 Unit Max 150 150 ns ns
Min Max Min Max Min Max Min tAVQV tELQV tACC tCE Address Valid to Output Valid Chip Enable Low to Output Valid E = VIL, G = VIL G = VIL 90 90 100 100 120 120
tGLQV tEHQZ(3) tGHQZ(3)
Output Enable tOE Low to Output Valid tDF Chip Enable High to Output Hi-Z
E = VIL
40
50
60
65
ns
G = VIL
0
30
0
30
0
40
0
50
ns
Output Enable tDF High to Output Hi-Z Address tOH Transition to Output Transition
E = VIL
0
30
0
30
0
40
0
50
ns
tAXQX
E = VIL, G = VIL
0
0
0
0
ns
1. TA = 0 to 70C, -40 to 85C, -40 to 105C or -40 to 125C; VCC = 5V 5% or 5V 10%; VPP = VCC 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP. 3. Sampled only, not 100% tested.
17/24
DC and AC parameters Figure 8.
A0-A14 tAVEL Q0-Q7 DATA IN tQVEL VPP tVPHEL VCC tVCHEL E tELEH G tQXGL tGLQV tEHQX DATA OUT
M27C256B Programming and Verify modes AC waveforms
VALID
tGHQZ
tGHAX
PROGRAM
VERIFY
AI00759
Table 11.
Symbol tAVEL tQVEL tVPHEL tVCHEL tELEH tEHQX tQXGL tGLQV tGHQZ tGHAX
Programming mode AC characteristics(1) (2)
Alt tAS tDS tVPS tVCS tPW tDH tOES tOE tDFP tAH Parameter Address Valid to Chip Enable Low Input Valid to Chip Enable Low VPP High to Chip Enable Low VCC High to Chip Enable Low Chip Enable Program Pulse Width Chip Enable High to Input Transition Input Transition to Output Enable Low Output Enable Low to Output Valid Output Enable High to Output Hi-Z Output Enable High to Address Transition 0 0 Test Condition Min 2 2 2 2 95 2 2 100 130 105 Max Unit s s s s s s s ns ns ns
1. TA = 25 C; VCC = 6.25V 0.25V; VPP = 12.75V 0.25V. 2. VCC must be applied simultaneously with or before VPP and removed simultaneously or after VPP.
18/24
M27C256B
Package mechanical
5
Package mechanical
Figure 9. FDIP28WB - 28 pin Ceramic Frit-seal DIP, with window, package outline
A2 A3 A1 B1 B D2 D S
N 1 FDIPW-a
A L eA eB C
e
E1
E
1. Drawing is not to scale.
Table 12.
FDIP28WB - 28 pin Ceramic Frit-seal DIP, with window (round 0.280"), package mechanical data
millimeters inches Max 5.72 0.51 3.91 3.89 0.41 1.45 - 0.23 36.50 33.02 15.24 - - 13.06 2.54 14.99 - - 16.18 3.18 1.52 7.11 - 4 28 1.40 4.57 4.50 0.56 - 0.30 37.34 - - 13.36 - - 18.03 4.10 2.49 - 11 0.280 0.100 0.590 1.300 0.600 0.057 0.020 0.154 0.153 0.016 - 0.009 1.437 - - 0.514 - - 0.637 0.125 0.060 - 4 28 Typ Min Max 0.225 0.055 0.180 0.177 0.022 - 0.012 1.470 - - 0.526 - - 0.710 0.161 0.098 - 11
Symbol Typ A A1 A2 A3 B B1 C D D2 E E1 e eA eB L S N Min
19/24
Package mechanical Figure 10. PDIP28 - 28 pin Plastic DIP, 600 mils width, package outline
A2 A1 B1 B D2 D S
N
M27C256B
A L eA eB C
e1
E1
1
E
PDIP
1. Drawing is not to scale.
Table 13.
Symbol
PDIP28 - 28 pin Plastic DIP, 600 mils width, package mechanical data
millimeters Typ Min Max Typ 0.1750 0.0248 3.050 4.570 0.1500 0.0177 0.0500 0.230 36.830 33.020 15.240 13.720 2.540 15.000 12.700 - 14.800 15.200 3.300 1.78 0 28 2.08 10 14.480 - 15.200 16.680 0.1299 0.070 0 28 0.082 10 36.580 - 0.310 37.080 - 1.4500 1.3000 0.6000 0.5402 0.1000 0.5906 0.5000 - 0.5827 0.5984 0.5701 - 0.5984 0.6567 0.0091 1.4402 - 0.0122 1.4598 - 0.1201 0.1799 inches Min Max
A A1 A2 B B1 C D D2 E E1 e1 eA eB L S N
4.445 0.630 3.810 0.450 1.270
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M27C256B
Package mechanical Figure 11. PLCC32 - 32 pin Rectangular Plastic Leaded Chip Carrier, package outline
D D1
1N
A1 A2
B1 E2 E3 E1 E e F 0.51 (.020) 1.14 (.045) D3 R CP A E2 B
D2
D2
PLCC-A
1. Drawing is not to scale.
Table 14.
PLCC32 - 32 pin Rectangular Plastic Leaded Chip Carrier, package mechanical data
millimeters inches Max 3.56 2.41 - 0.53 0.81 0.10 12.32 11.35 4.78 7.62 - 14.86 13.89 6.05 10.16 1.27 - - 0.00 0.89 - 32 12.57 11.51 5.66 - 15.11 14.05 6.93 - - 0.13 - 0.035 0.400 0.050 0.300 0.485 0.447 0.188 - 0.585 0.547 0.238 - - 0.000 - 32 Typ Min 0.125 0.060 0.015 0.013 0.026 Max 0.140 0.095 - 0.021 0.032 0.004 0.495 0.453 0.223 - 0.595 0.553 0.273 - - 0.005 -
Symbol Typ A A1 A2 B B1 CP D D1 D2 D3 E E1 E2 E3 e F R N Min 3.17 1.53 0.38 0.33 0.66
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Part numbering
M27C256B
6
Part numbering
Table 15.
Example: Device Type M27 Supply Voltage C = 5V Device Function 256B = 256 Kbit (32Kb x 8) Speed -45 (1)= 45 ns -60 = 60 ns -70 = 70 ns -80 = 80 ns -90 = 90 ns -10 = 100 ns -12 = 120 ns -15 = 150 ns -20 = 200 ns -25 = 250 ns VCC Tolerance blank = 10% X = 5% Package F = FDIP28W B = PDIP28 C = PLCC32 Temperature Range 1 = 0 to 70 C 3 = -40 to 125 C 6 = -40 to 85 C Options TR = Tape & Reel Packing
1. High Speed, see AC Characteristics section for further information.
Ordering information scheme
M27C256B -70 X C 1 TR
For a list of available options (Speed, Package, etc) or for further information on any aspect of this device, please contact the STMicroelectronics Sales Office nearest to you.
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M27C256B
Revision history
7
Revision history
Table 16.
Date July 1998 20-Sep-2000 29-Nov-2000 02-Apr-2001 29-Aug-2002
Document revision history
Version 1.0 1.1 1.2 1.3 1.4 First Issue AN620 Reference removed PLCC codification changed (Table 15.) FDIP28W mechanical dimensions changed (Table 12.) Package mechanical data clarified for PDIP28 (Table 13.), PLCC32 (Table 14., Figure 11.) and TSOP28 (Table 15., Figure 13.) Document converted to new template (sections added, information moved). TSOP28 package removed. Packages are ECOPACK(R) compliant. X option removed from Table 15: Ordering information scheme. Revision Details
18-May-2006
2
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M27C256B
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